Printed Circuit Board Using a Foam Hybrid Via Process

Printed circuit boards (PCBs) are ubiquitous in electronics, used to mechanically support and electrically connect electronic components. Conventional assemblies comprise rigid layers that sometimes limit their spatial flexibility or impose specific design constraints. There is a critical need for technology that increases the flexibility and utility of these assemblies. The fundamental problem with conventional methods is the lack of a material that can serve dual purposes: providing mechanical support and adequate spacing between different layers. Traditional methods utilize materials that are often excessively rigid or lack the necessary properties to facilitate proper functioning. Furthermore, these methods don't provide adequate support and separation, leading to potential interference and inefficiencies.

Technology Description

This technology comprises a printed circuit board assembly that integrates a foam dielectric material. This assembly structure includes at least one layer of foam dielectric, having properties akin to air. This layer is postioned between a top sublaminate and a bottom sublaminate. The bottom sublaminate can either be a regular printed circuit board, composed of various layers. Conversely, the top sublaminate could be a singular layer or multiple layers and might also incorporate an antenna. What differentiates this technology is its unique approach in providing mechanical support and promoting physical separation in electronic components. The foam dielectric material operates as a support system for the top sublaminate and the central conductor. Additionally, it is instrumental in maintaining a distinct separation between the bottom sublaminate and the antenna. This distinctive methodology enhances the overall structural integrity and performance of the printed circuit board.