Space-Time Modulated Active 3D Imager-on-Chip

In the field of imaging, 3D imagers play a significant role in delivering depth information that adds a new dimension to regular two-dimensional images. One of the longstanding issues with 3D imagers, however, is the constraint related to size, weight, and power, often abbreviated as SWaP. This makes them untenable for applications that require compactness and portability or low power consumption. Additionally, typical 3D imagers suffer from bottleneck issues with readout circuitry, which limit their performance. Sunlit environments prove challenging for these imagers as they typically fail to deliver clear images when exposed to bright light. These inherent issues with conventional 3D imagers not only limit their performance, but also their scope of applications.

Technology Description

This technology is a three-dimensional imager that functions differently from conventional imagers. This imager operates by illuminating a scene with modulated light, which consists of a viewpoint-independent pattern. This light is followed up by detecting diffuse reflections from the scene to create an initial image. That image is then digitally enhanced by correcting the background and comparing it against a known reference image, finally resulting in a depth image. What sets this imager apart is that it is not limited by size, weight, and power considerations like its predecessors. It can also effectively image in sunlit environments, an ability absent in previous technology. Furthermore, there is a significant improvement in signal-to-noise performance. These improvements address the traditional drawbacks of readout circuitry bottlenecks and SWaP constraints prevalent in existing 3D imagers.