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In the Media
January 28, 2025
The associate leader in the Advanced Materials and Microsystems Group at Lincoln Laboratory strongly believes in the power of collaboration and how it seeds innovation.
![three photos: left shows an air traffic control radar; middle shows an SEM photo of microelectronic devices; and right shows a close-up of a laser.](/sites/default/files/styles/list/public/news/image/2024-02/IEEE_ThreeMilestone_Web_3_Updated.jpg?itok=5h95s6Qh)
Awards
February 15, 2024
![A photo of a multicolored wafer containing integrated circuits.](/sites/default/files/styles/list/public/news/image/2021-10/515915006D.jpg?h=e5565190&itok=t-J5iXEI)
In the Media
September 25, 2023
![an intern dressed in a "bunny suit" leans against a machine in the microelectronics laboratory.](/sites/default/files/styles/list/public/news/image/2023-08/MMIP-Intern-Reyes.png?itok=OpJ457BT)
August 29, 2023
![A researcher holds a wafer, while standing in front of a material deposition machine.](/sites/default/files/styles/list/public/news/image/2023-04/MIT_2-D-Materials-01-PRESS_0.jpg?h=863e93a8&itok=1chMCcf3)
In the Media
April 28, 2023
![Ice fractures at the Great Lakes Research Center.](/sites/default/files/styles/list/public/news/image/2023-04/glrc-mit-arctic-seismography-202303090046-banner2400.jpg?itok=q5bH6xiM)
In the Media
April 11, 2023
![Erin Doran, a textile specialist, is photographed next to a textile weaving machine, with her hands on a fabric being woven.](/sites/default/files/styles/list/public/news/image/2023-03/526282-001D.jpg?itok=Nu7gyNfZ)
March 7, 2023
![Five small 3D-printed vessels of various colors (white, browns) and shapes (cups, pyramid shapes](/sites/default/files/styles/list/public/news/image/2022-09/3DGlassStructures.png?itok=KG7rJA65)
September 19, 2022
![Patrick Upton](/sites/default/files/styles/list/public/news/image/2022-07/Patrick%20Upton.jpg?itok=yczRrQKK)
In the Media
July 12, 2022