Publications

The dominant trend with conventional image sensors is toward scaled-down pixel sizes to increase spatial resolution and decrease chip size and cost. While highly capable chips, these monolithic image sensors devote substantial perimeter area to signal acquisition and control circuitry and trade off pixel complexity for fill factor. For applications...

We demonstrate the transfer of the largest (150 mm in diameter) available InP-based epitaxial structure to the silicon-on-insulator substrate through a direct wafer-bonding process. Over 95% bonding yield and a void-free bonding interface was obtained. A multiple quantum-well diode laser structure is well-preserved after bonding, as indicated by the high-resolution...

The development of a technique with the ability to detect trace quantities of explosives at a distance is of critical importance. In numerous situations when explosive devices are prepared, transported, or otherwise handled, quantifiable amounts of the explosive material end up on surfaces. Rapid detection of these chemical residues in...

Applications of microfluidics require a self-contained, active pumping system in which the package size is comparable to the volume of fluid being transported. Over the past decade, several systems have been developed to address this issue, but either these systems have high power requirements or the microfabrication is too complex...

We investigate the remote detection of explosives via a technique that vaporizes and photodissociates the condensed-phase material and detects the resulting vibrationally excited NO fragments via laser-induced fluorescence. The technique utilizes a single 7 ns pulse of a tunable laser near 236:2nm to perform these multiple processes. The resulting blue-shifted...

At Lincoln Laboratory, we have established a three dimensional (3D) integrated circuit (IC) technology that has been developed and demonstrated over eight designs, bonding two or three active circuit layers or tiers to form monolithically integrated 3D circuits. This technology has been used to successfully demonstrate a large-area 8 x...

We have developed and demonstrated a highduty- cycle asynchronous InGaAsP-based photon counting detector system with near-ideal Poisson response, roomtemperature operation, and nanosecond timing resolution for near-infrared applications. The detector is based on an array of Geiger-mode avalanche photodiodes coupled to a custom integrated circuit that provides for lossless readout via...

The energy-level structure of a quantum system, which has a fundamental role in its behaviour, can be observed as discrete lines and features in absorption and emission spectra. Conventionally, spectra are measured using frequency spectroscopy, whereby the frequency of a harmonic electromagnetic driving field is tuned into resonance with a...

A 64 x 64-pixel test circuit was designed and fabricated in 0.18- m CMOS technology for investigating high-speed imaging with large-format imagers. Several features are integrated into the circuit architecture to achieve fast exposure times with low-skew and jitter for simultaneous pixel snapshots. These features include an H-tree clock distribution...

We present a scheme for implementing quantum operations with superconducting qubits. Our approach "coupler" qubit to mediate a controllable interaction between data qubits, pulse sequences which strongly mitigate the effects of 1/f flux noise, and a high-Q resonator-based local memory. We develop a Monte Carlo simulation technique capable of describing...